XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Founded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Description. Farnell Israel offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 2. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. XCede HD2 backplane interconnect system. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. XCede ® HD and XCede ® HD Plus, this connector provides . High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 1. We offer interconnection systems from 2. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. These connectors are two-piece devices that connect two printed circuit boards. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. You previously purchased this product. 6. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. backplane to expander board connector (BP_XCEDE_2) 3. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Customer Measurement Report: FCI XCede® Connector. 2 TB-2244 XCede HD Family Daughtercard Connector Press-Fit Installation Process 3. 4-, 5-, 6-, 8-pair configurations. These connectors are two-piece devices that connect two printed circuit boards. backplane to expander board connector (BP_XCEDE_3) 2. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. Get a Free Sample. 1 DOCUMENTS 2. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. EN. Article: 00028492. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. 2-to-PCIE-x4 adapter cable - but it runs $150. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Search. Formed in 2020 by a merger of three well. 28 Figure 15: XCede pressing Force vs. DETAILS. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall XCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. XCede Connectors are available at Mouser Electronics. XCede® Connectors - Amphenol CS | DigiKey2020 Dodge Ram 1500 TIPM Module Connector (G36C42) TIPM Module Connector (G36C42) (3) List Price. Modular design provides flexibility in applications. The SMA (or Sub-Miniature A) connector has a 50Ω impedance and can handle frequencies up to 17 GHz. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Out of these, the cookies that are categorized as necessary are stored on your browserGermany. Memory card connector / PCI. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. XCede® connectors also address. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. See Appendix "A" for the seating press recommendations and process recommendations. Buy Amphenol JX41051436 in Avnet APAC. Contact us today for more details of XCede HD, part number 968-4200-A1H. ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。. See Appendix “A” for the seating press recommendations and process recommendations. Revision SCR No. 40G QSFP+ to QSFP+ DAC Cable. Formed in 2020 by a merger of three well-established organisations — TechStream, Xcede and Etonwood — our mission is to attract the talent that is helping our clients shape the new global economyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. Farnell UK offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The diagram below, created by NTT DATA based on the IDS-RAM Information Model *3, shows the basis of data model. 00 mm contact wipe on signal pins. 4-, 5-, 6-, 8-pair configurations. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. 10120130-Y0J-20DLF Datasheets | Backplane Connectors Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Right By apogeeweb, 10120130-Y0J-20DLF, 10120130-Y0J-20DLF Datasheet,10120130-Y0J-20DLF PDF,Amphenol ICC (FCI)XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Login or REGISTER Hello, {0}. 1. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 63. Dislaime Please note that the above information is subect to change without notice. connector contacts The COB system satisfies the most various installation needs thanks to the interchangeability of the connector inserts. Features & Benefits. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. DETAILS. 7. Description Initial Date “A” S2401 Initial Release E. Brand of Product：Amphenol ICC,Part#：946-210X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. See section 4 regarding XHD2 RAM connectors. Board-to-board connector / rectangular / SMT. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 384 likes · 6 talking about this · 259 were here. Description. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. 3. The connectors are intermatable, electrically and mechanically interchangeable. jx410-51594 rev drawing no. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. Video Library > XCede® HD - Samtec’s High-Density Backplane System XCede® HD - Samtec’s High-Density Backplane System XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. DC Connector Configurations XCede HD connector system. Daugtercard connectors feature Amphenol’s integral stiffener which allows designersDataspace Connector's data model is designed based on IDS-RAM. Up to 3. Mouser offers inventory, pricing, & datasheets for Amphenol XCede High Speed / Modular Connectors. 08mm. power connector (J_PWR_A) 6. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82 differential pairs/inch. 提供集成式导引、锁合以及顶针侧壁. 40G QSFP+ to QSFP+ AOC Cable. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. High-density backplane system – up to 84 differential pairs per linear inch. see tb-xxxx for board weight limitations. The XCede ® I/O connector supports next generation 100G+ applications and. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. These connectors are two-piece devices that connect two printed circuit boards. 提供集成式导引、锁合以及顶针侧壁. 2. XCede® Stacker. XCede Connectors are available at Mouser Electronics. TARGET MARKETS. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. We would like to show you a description here but the site won’t allow us. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. DC Connector Configurations. 适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。Amphenol XCede HD Series Backplane Connectors are available at Mouser Electronics. 1. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. XCede® connectors also address. As the name suggests, SDRAM is synchronous and relies on the clock for signals, thus. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Guidance and keying options. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. REFER TO TB-2150 FOR XCede PRODUCT SPECIFICATIONS. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. asm jx410-51594_bp. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. 信号端子上可实现高达3. XCede HD achieves the highest performance in an HM compatible form factor. View eCAD Files. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. 1 DOCUMENTS 2. 4、6或8列. 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. . XCede® HD 1. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Please confirm your currency selection:2. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 54, 3. This connector is a single-row, 40-pin, right-angle male header strip that can be cut or broken into smaller strips and is great for low-profile connections. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. 2. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). Daugtercard connectors feature Amphenol’s integral stiffener which allows designersXCede ® High-Performance Backplane Connector System. Contact Mouser (USA) (800) 346-6873 | Feedback. 7. Buy XCede HD Series Backplane Connectors. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. Español $ USD United States. signal connector (J_BP_SIG) 5. Search for: Search Home; Categories. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Contact Mouser (USA) (800) 346-6873 | Feedback. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Improves signal integrity and increases signal. Each ball and socket mount is designed and manufactured using the highest quality materials, and is backed by a lifetime warranty. XCede® connectors also address requirements for high linear signal density at the backplane. 7mil Drill Minimum Pad Size vs. Manufacturer of Connector and Connector Systems. power connector (J_PWR_B) 7. For XCede HD RAM. Three levels of sequencing enable hot plugging. challenging architectures. 11. Scalable upgrades to 56Gb/s. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. XCede® connectors also address. An organizer can be used to combine groups of right-angle signal, guide and power modules establishing an integrated daughter card connector or. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 7. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Commercial Standards 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. 1. 12 - 48 pairs. These modules consist of a 12. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. KK connector systems are customizable for a variety of power and signal applications. XCede® RAM. 4. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. - FCI. 0 REFERENCE 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). Click OK to extend your time for an additional 30 minutes. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. MTP to 4x LC breakout cable is composed of an 8-fiber MTP connector for 40G QSFP+ at one end and 4 duplex LC connectors for 10G SFP+ at the other end. XCede® connectors also address. The XCede ® HD Plus backplane connector achieves high . Amphenol Communications Solutions XCede high-performance backplane connector system. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. FEATURES. 1. 54 - 5. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. FEATURES. use keep out zone. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. 1. 3. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede. 3. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 0 DEFINITIONS 4. XCede ® HD Plus. Female pin. Mouser offers inventory, pricing, & datasheets for XCede Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. Connections hint for November 24. 1. Amphenol is one of the leading manufacturers of Backplane connectors. Skip to Main Content (800) 346-6873. These connectors are available in 3-, 4- and 6-Pair configurations. The XCede HD connector. 信号端子上可实现高达3. TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. Contact Mouser (USA) (800) 346-6873 | Feedback. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. DETAILS. 0 REFERENCEDOCUMENTS 2. Multiple signal/ground pin staging options. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. Advanced Search. XCede Product Family Connector Press-fit Installation Process . FCI released XCede vertical backplane headers and right-angle daughter card receptacles designed for 25 Gb/s performance. 1. 2 mm, Receptacle, Press Fit, 2 Rows. 11. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. Up to 82 differential pairs per linear inch. Features. Send us a Message. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. XCEDE CONNECTOR ECCN / UNSPSC / COO. Contact us today for more details of XCede HD, part number 968-4200-A1H. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 20mm Power Modules. Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. Login or REGISTER Hello, {0}. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 7mil Drill Minimum Pad Size vs. XCede HD achieves the highest performance in an HM compatible form factor. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. 423-0155-500 MOUNTING BLOCK. No spam. 1. 1. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. 99 $ 19. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. The XCede HD connector. Buy HPTS-3-S-D-VT - Samtec - Connector, Xcede HD Series, 4 Contacts, 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Integrated power and guidance. Mechanical longevity and ruggedness. XCede® connectors also address. DETAILS. Accepts 1. distance curve will begin to further increase in slope. 5. . Backwards mate compatibility. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. Find Parts Learn More. 2. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. 3A per pin current rating and mount individually to the backplane. 4 differential signal pairs per inch are provided corresponding to a minimum slot spacing of 36 mm. AMPHENOL COMMUNICATIONS SOLUTIONS. 1. Login or REGISTER Hello, {0}. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 6. 1 Fillets An extension of the pad at the interface of the trace to the pad that will allow more pad area in the event that the pad to hole registration compromises the interconnect area. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Check Pricing. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. 1. $ 173. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. Features. For optimal connector configuration, connectors are grouped into signal modules of 4,. Nov 13, 2019. This specification covers the performance, test, and quality requirements for the XCede HD Plus backplane interconnect system. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3. Mouser offers inventory, pricing, & datasheets for XCede Connectors. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. 85.